Mouser has recently partnered with Xvisio Technology to distribute their high-performance vSLAM technology worldwide. The SeerSense AIOT camera modules, equipped with vSLAM technology, are designed for advanced applications, including AR/VR head-mounted displays, drones, industrial automation, 3D face recognition, and 3D scanning. The SeerSense XR50 module is an independent vSLAM computing unit that connects effortlessly to AR/VR and robotic devices, providing multiple working modes through USB 2.0 and optional Bluetooth 5.0 connectivity. The SeerSense DS80 module includes both passive stereo semi-global block matching and active ToF depth engines, providing a comprehensive solution for vSLAM, depth, vision AI, and computer vision edge computing. The device can offload host resource loading and minimize power consumption. Xvisio Technology has dedicated years to spatial perception and human-machine interaction technology and is enthusiastic about partnering with Mouser Electronics to roll out their products worldwide for rapid proof of concept development and volume production.
Mouser Announces Global Distribution Agreement with Xvisio Technology for High-Performance vSLAM Technology
Mouser, one of the world’s leading component distributors and manufacturers, has entered into a global distribution agreement with Xvisio Technology. The agreement will enable Mouser to provide Xvisio’s high-performance vSLAM (Visual Simultaneous Localisation and Mapping) technology to its customers.
Xvisio’s SeerSense AIOT camera modules, which offer vSLAM technology, will be distributed by Mouser. These modules are integrated with sensor fusion and can be used for various advanced applications like AR/VR head-mounted displays, drones, industrial automation, 3D face recognition, and 3D scanning.
The SeerSense XR50 module is equipped with an independent vSLAM computing unit that does not require host intervention, making it easy to connect to AR/VR and robotic devices. With a low power consumption rate and a compact size of 75mm × 14mm × 8.9mm, the module is an excellent option for space-constrained applications. The module provides multiple working modes through USB 2.0 and optional Bluetooth 5.0 connectivity. Designers can customize the device for different baseline and ID requirements to offer design flexibility.
The SeerSense DS80 module comes with both passive stereo semi-global block matching and active ToF depth engines on a single device. This provides a comprehensive solution for vSLAM, depth, vision AI, and computer vision edge computing. The device includes a 13MP RGB camera, dual 2MP fisheye cameras, VGA ToF camera, a high-performance IMU, a USB Type-C port, and an extension GPIO port. With its onboard computing engines, the device can offload host resource loading and minimize power consumption. The company also provides feature-rich SDKs and toolkits for rapid development, enabling designers to quickly leverage advanced machine perception capabilities.
John Lin, the President and CEO of Xvisio Technology, stated that the company is dedicated to spatial perception and human-machine interaction technology. He also expressed enthusiasm about partnering with Mouser Electronics to introduce their products to the industry worldwide for both rapid proof of concept development and volume production.
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